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Morel Equipments Co.,Ltd
Morel Equipments CO.,Ltd
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High Production Capacity SMT Reflow Oven , SMT Reflow Soldering Machine

Morel Equipments Co.,Ltd
Morel Equipments Co.,Ltd
City: Shenzhen
Province/State: Guangdong
Country/Region: China
Tel: 86-755-21635007
Contact Person:Mr Tom Chen

High Production Capacity SMT Reflow Oven , SMT Reflow Soldering Machine

Brand Name : KT
Model Number : KTR-1200D
Certification : CE ,ISO
Place of Origin : China
MOQ : 1unit
Price : Negotiation
Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability : 5Unit/Month
Delivery Time : 25 days
Packaging Details : Wooden packing
Dimension(L × W × H) : 7050*1680*1530
Weight : Approx 3360 kg
Length of heating zone : 4765mm
Number of heating zone : Top 12/Bottom 12
Number of cooling zone : Top 3/Bottom 3
Power supply : 3 phase ,380v 50/60HZ(Option:3 phase ,220v 50/60HZ
Total power : 99KW
Temperature control range : Room Temperature -300℃
Temperature control method : PID close loop control + SSR driving
Temperature control precision : ±1℃
Temperature deviation on PCB : ±1.5℃(by RM board test standard)
Max width of PCB : 400mm(option:460mm) dual-rail 300mm*2
Range of rail width : 50-400mm(option:50-460mm) dual-rail 300mm*2
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KTR Series Lead-Free Hot Air Reflow Ovens KTR-1200D

Product features:

  • Using the world's leading microcirculation technology, the whole furnace is divided into 3232 independent cells, compared with the small loop structure, by
  • In the small cycle of its hot air blowing from the outlet after a furnace through the distance will be the furnace around the return air outlet to recover, and
  • In the recovery process, but also with the furnace and other outlet gas blowing interference, resulting in the temperature of each piece of PCB
  • The line is constantly fluctuating, so that the welding accuracy is affected, and the microcirculation hot air system is how many points of the jet, there are many points back
  • Received the technology, popular words is that every outlet around it is its own outlet, so that greatly guarantee the temperature inside the furnace
  • Uniform, the board surface in the heat because it will not produce a similar small cycle because the return air process and the resulting refraction of the romantic shadow phenomenon, so
  • PCB soldering temperature curve when the temperature is very high, very suitable for lead-free process space window small component welding.

Product parameter:


Machine parameter
Dimension(L × W × H)7050*1680*1530
ColorComputer grey
WeightApprox 3360 kg
Number of heating zoneTop 12/Bottom 12
Length of heating zone4675mm
Number of cooling zoneTop 3/Bottom 3
Rectifying plate structureSmall circulation
Exhaust volume requiement12m³/min*2(Exhausts)
Control system
Power supply requiement3 phase ,380v 50/60HZ(Option:3 phase ,220v 50/60HZ
Total power99KW
Startup power44KW
Normal power consumption12KW
Warming TimeApprox:20min
Temperature control rangeRoom Temperature -300℃
Temperature control methodPID close loop control + SSR driving
Temperature control precision±1℃
Temperature deviation on PCB±1.5℃(by RM board test standard)
Data storageProcess data and status storage
Abnormal alarmAbnormal temperature(extra-high/extra low temperature after constant temperature)
Board dropped alarmSingal light(yellow-warning;green normal;red -Abnormal
Conveyor system
Rails structureOverall sectional type
Chain structureDouble buckle for preventing board jammed
Max width of PCB400mm(option:460mm) dual-rail 300mm*2
Range of rail width50-400mm(option:50-460mm) dual-rail 300mm*2
Component heightTop 30/Bottom 30mm
Conveyor directionL→R(option:R→L)
Conveyor rail fixed typeFront rail fixed(option: Rear rail fixed)
PCB conveyor directionAir-reflow=chain+mesh(N2-reflow=chain option:mesh)
Conveyor height900±20mm
Conveyor speed300-2000mm/min
Auto-lubricationMulti-lubricating mode can be chosen
Cooling system
Cooling methodFirced air Water chiller

Product Tags:

pcb reflow oven

      

hot air reflow oven

      
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