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Morel Equipments Co.,Ltd
Morel Equipments CO.,Ltd
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Large Double Track Solder Paste Inspection Machine D450 Gerber Data Conversion

Morel Equipments Co.,Ltd
Morel Equipments Co.,Ltd
City: Shenzhen
Province/State: Guangdong
Country/Region: China
Tel: 86-755-21635007
Contact Person:Mr Tom Chen

Large Double Track Solder Paste Inspection Machine D450 Gerber Data Conversion

Brand Name : SINIC
Model Number : D450
Certification : CE、 ISO
Place of Origin : CHINA
MOQ : 1 unit
Price : Negetiation
Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability : 10 unit / month
Delivery Time : 20 work days
Packaging Details : wooden packing
Automatic Grade : Automatic
machine Dimension : 1000*1000*1525mm
Transport Package : Standard Wooden Package
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Solder Paste Inspection D450


1. The use of PSLM combined with the PMP to achieve 100% high-precision solder paste 3D measurement in SMT production line.


2. Using PSLM technology, changed the traditional way of generating 3D Struct Light, the traditional glass grating moire required mechanically driven by a piezoelectric motor(PZT).By using PSLM, no need glass grating and mechanical parts any more. The elimination of the mechanical drive and moving parts, greatly improving the ease of use and avoid mechanical wear and reduce maintenance costs.


3. By using the Stop&Catch methods combined with multiple image acquisition, realize highly repeatable 3D results on the solder paste measurement. Compared to conventional scanning just take one pictures only on the solder paste a scan sampling, multiple image acquisition greatly enhancing the accuracy and reliable test results.


4. Patened D-Lighting technology achieves full light spectrum detect ability. It is perfect solution to solve the shadow effect and reduce noise interference during 3D measurement.


5. Gerber data conversion and import, achieve automatic detection of the entire board. Manual “teach” function realize user-friendly programming and test job generation in case of no Gerber data situation.


6. The maximum detectable height increased from the traditional±350um to±1200um, not only can detect solder paste, also applies to the detection of opaque objects, such as red glue and black epoxy and other none transported object.


7.Friendly and simple user interface, five minutes of programming and one key operation.


8. Powerful “statistical process control(SPC)”, Provide a plenty of tools, user-friendly real-time monitoring, reduce defects caused by poor solder paste printing and improve final product quality.


9. The application range like: mobile phones, tablet PC, computer and accessories, digital cameras, camcorders, automotive, medical, server, LED, FPC, communication products etc.


Products DescriptionDual-track
ModelD450
Measurement Principle3D white light PSLM PMP(Programmable Spatial Light Modulation,commonly
known as moire fringe technology)
MeasurementsVolume,acreage,height, XY offset, shape
Detected DefectsMissing print,insufficient tin, excessive tin, bridging, offset, shape defects, surface contamination
Camera Pixel5M, 10M/12M as option
Lens TypesTelecentric lens
Lens Resolution16.5um ,8/10/12/13.5/18um as option
FOV Size

5M 16.5um 42*33.5mm

10M 12um 48*31.5mm

XY Positioning AccuracyXY accuracy:10um;Height:0.37um
RepeatabilityHeight:<1um (4 Sigma);volume/acreage:<1%(4 Sigma)
Gage R&R<<10%
FOV Speed0.3s/FOV
Quantity of Inspection HeadTwin-Heads (Single Head, Tri-Heads as option)
Red Green Blue/RGB Three Colas
Option Light Source
Standard configuration
Mark-point Detection Time0.5 sec/piece
Real-time Z-axis Compensation for PCB WarpStandard configuration
Max. Measuring Height±550um ( ±1200um as option)
Max. Measuring Height
of PCB Warp
±5mm
Minimum Pad Spacing100um ( pad height of 150um as the reference)
Smallest Measuring SizeRectangle:150um;Round:200um
Maximum PCB Size

Dual-track Model: 50*50~L450/630 x W300 mm

Single track Model:50*50~L450/630 x W590 mm

PCB Thickness0.4-7mm
Top and Bottom ClearanceTop 40mm,Bottom 40mm
Board Edge Clearance3mm , (multifunctional clip edge as option)
Flexible or Fixed Orbit SettingTrack 1 fixed, track 2,3,4 flexible; the distance between track 1 and track 4 is 686mm, and the maximum distance between track 1 and track 2, track 3 and track 4 are 300mm.
PCB Transfer DirectionLeft to right or right to left, set before delivery
Orbit Width AdjustmentManual, automatic as option
SPC StatisticsHistogram;Xbar-R Chart;Xbar-S Chart;CP&CPK;%Gage Repeatability Data;SPI Daily/Weekly/Monthly Reports
Gerber & CAD Data ImportSupport Gerber format(274x,274d);Manual Teach model ;
CAD X/Y,Part No.,Package Type import
Computer typeHP Precision Workstation
Computer ConfigurationCPUIntel 6-core (Intel 8-core as option)
RAM32G(48/64G as option)
GPU2G discrete graphics (6G/8G DP as option)
Hard disk1T (2T as option)
DVD+RWStandard configuration
Operating SystemWindows 7 Professional ( 64 bit)
Equipment Dimension
and Weight

W1000*D1330*H1530mm;1050KG

W1200*D1330*H1530mm;1200KG

Power220V,10A
Air Pressure4~6Bar
Power (Start / normal)Start:2.5kw / Normal operation:2kw
Loading Requirements
of the Floor
600kg/m²
Options1D / 2D Barcode scanner,Badmark function,ultrasonic sensor,Fingerprint identification module ,Network SPC,1 band 4 centralized control software,printer closed-loop control,Rework Station,off-line programming software, UPS continuous power supply.


Product Tags:

solder paste inspection system

      

spi equipment

      
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