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Morel Equipments Co.,Ltd
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S8030 Solder Paste Inspection Machine For Red Glue And Black Epoxy Testing

Morel Equipments Co.,Ltd
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Morel Equipments Co.,Ltd
City: Shenzhen
Province/State: Guangdong
Country/Region: China
Tel: 86-755-21635007
Contact Person:
Mr Tom Chen

S8030 Solder Paste Inspection Machine For Red Glue And Black Epoxy Testing

Brand Name : SINIK
Model Number : S8030
Certification : CE
Place of Origin : CHINA
MOQ : 1 unit
Price : Negotiation
Payment Terms : D/A, D/P, L/C, T/T, Western Union, MoneyGram
Supply Ability : 10 unit/month
Delivery Time : 20 works day
Packaging Details : M:1000x1000x1525mm;800KG L :1000x1130x1525mm;865KG
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S8030 Solder Paste Inspection Machine


1. The use of PSLM combined with the PMP to achieve 100% high-precision solder paste 3D measurement in SMT production line.


2. Using PSLM technology, changed the traditional way of generating 3D Struct Light, the traditional glass grating moire required mechanically driven by a piezoelectric motor(PZT).By using PSLM, no need glass grating and mechanical parts any more. The elimination of the mechanical drive and moving parts, greatly improving the ease of use and avoid mechanical wear and reduce maintenance costs.


3. By using the Stop&Catch methods combined with multiple image acquisition, realize highly repeatable 3D results on the solder paste measurement. Compared to conventional scanning just take one pictures only on the solder paste a scan sampling, multiple image acquisition greatly enhancing the accuracy and reliable test results.


4. Patened D-Lighting technology achieves full light spectrum detect ability. It is perfect solution to solve the shadow effect and reduce noise interference during 3D measurement.


5. Gerber data conversion and import, achieve automatic detection of the entire board. Manual “teach” function realize user-friendly programming and test job generation in case of no Gerber data situation.


6. The maximum detectable height increased from the traditional±350um to±1200um, not only can detect solder paste, also applies to the detection of opaque objects, such as red glue and black epoxy and other none transported object.


7. Friendly and simple user interface, five minutes of programming and one key operation.


8. Powerful “statistical process control(SPC)”, Provide a plenty of tools, user-friendly real-time monitoring, reduce defects caused by poor solder paste printing and improve final product quality.


9. The application range like: mobile phones, tablet PC, computer and accessories, digital cameras, camcorders, automotive, medical, server, LED, FPC, communication products etc.


Products DescriptionStandard Model
ModelS8030
Measurement Principle3D white light PSLM PMP(Programmable Spatial Light Modulation,commonly
known as moire fringe technology)
MeasurementsVolume,acreage,height, XY offset, shape
Detected DefectsMissing print,insufficient tin, excessive tin, bridging, offset,shape defect, surface contamination
Camera Pixel4M, 5M as option
Lens TypesTelecentric lens
Lens Resolution15um,(18um/16.5um/13.5um as option)
FOV Size30*30mm
AccuracyXY Resolution):1um;Height:0.37um
RepeatabilityHeight:≤1um (6 Sigma);volume/acreage:<1%(6 Sigma)
Gage R&R< 10%
FOV Speed0.4s/FOV
Red Green Blue/RGB Three Colas
Option Light Source
Standard configuration
Mark-point Detection Time0.5 sec/piece
Compensation Plate Bending
of Real-time Lift in Z-axis
Standard configuration
Max. Measuring Height±550um ( ±1200um as option)
Max. Measuring Height
of PCB Warp
±5mm
Minimum Pad Spacing150um ( pad height of 150um as the reference)
Smallest Measuring SizeRectangle:150um;Round:200um
Maximum PCB SizeL460xW460mm
PCB Thickness0.4-7mm
Top and Bottom ClearanceTop 30mm,Bottom 40mm
Board Edge Clearance3mm , (multifunctional clip edge as option)
Flexible or Fixed Orbit SettingFront orbit (back orbit as option)
PCB Transfer DirectionLeft to right or right to left
Orbit Width AdjustmentManual, automatic as option
SPC StatisticsHistogram;Xbar-R Chart;Xbar-S Chart;CP&CPK;%Gage Repeatability Data;SPI Daily/Weekly/Monthly Reports
Gerber & CAD Data ImportSupport Gerber format(274x,274d);Manual Teach model ;CAD X/Y,Part No.,Package Type import
Computer typeHP server
CPUIntel 4-core
RAM32G
GPU2G discrete graphics(4G as option)
Hard disk1T
DVD+RWStandard configuration
Operating SystemWindows 7 Professional ( 64 bit)
Equipment Dimension
and Weight
1000x1000x1525mm;865KG
Power220V,10A
Air Pressure4~6Bar
Power (Start / normal)Start:2.5kw / Normal operation:2kw
Loading Requirements
of the Floor
600kg/m²
OptionsMultifunctional clip edge, 1D / 2D Barcode scanner, Badmark function, printer closed-loop control, off-line programming software, Rework station, dynamic Mark point read function, coaxial Mark point camera ,
UPS continuous power supply .

Product Tags:

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S8030 Solder Paste Inspection Machine For Red Glue And Black Epoxy Testing Images

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