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3D Spi Solder Paste Inspection Equipment PSLM Technology , 0.37um Height

3D Spi Solder Paste Inspection Equipment PSLM Technology , 0.37um Height

Brand Name : SINIC
Model Number : T-1010a
Certification : CE、ISO
Place of Origin : CHINA
MOQ : 1 unit
Price : Negotiation
Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability : 10 units/ month
Delivery Time : 20 work days
Packaging Details : wooden packing
Function : High Temperature Resistance
Automatic Grade : Automatic
Machine Dimension : 1500*1100*600mm
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Solder Paste Inspection T-1010a

1. The use of PSLM combined with the PMP to achieve 100% high-precision solder paste 3D measurement in SMT production line.

2. Using PSLM technology, changed the traditional way of generating 3D Struct Light, the traditional glass grating moire required mechanically driven by a piezoelectric motor(PZT).By using PSLM, no need glass grating and mechanical parts any more. The elimination of the mechanical drive and moving parts, greatly improving the ease of use and avoid mechanical wear and reduce maintenance costs.

3. By using the Stop&Catch methods combined with multiple image acquisition, realize highly repeatable 3D results on the solder paste measurement. Compared to conventional scanning just take one pictures only on the solder paste a scan sampling, multiple image acquisition greatly enhancing the accuracy and reliable test results.

4. Patened D-Lighting technology achieves full light spectrum detect ability. It is perfect solution to solve the shadow effect and reduce noise interference during 3D measurement.

5.Gerber data conversion and import, achieve automatic detection of the entire board. Manual “teach” function realize user-friendly programming and test job generation in case of no Gerber data situation.

6. The maximum detectable height increased from the traditional±350um to±1200um, not only can detect solder paste, also applies to the detection of opaque objects, such as red glue and black epoxy and other none transported object.

7. Friendly and simple user interface, five minutes of programming and one key operation.

8. Powerful “statistical process control(SPC)”, Provide a plenty of tools, user-friendly real-time monitoring, reduce defects caused by poor solder paste printing and improve final product quality.

9. The application range like: mobile phones, tablet PC, computer and accessories, digital cameras, camcorders, automotive, medical, server, LED etc.

Measurement Principle3D white light PSLM PMP(Programmable Spatial Light Modulation,commonly known as moire fringe technology)
MeasurementsVolume,acreage,height, XY offset, shape
Detected DefectsMissing print,insufficient tin, excessive tin, bridging, offset,shape defect, surface contamination
Camera Pixel2M
Lens Resolution20um
FOV Size26 X 20mm
Height Accuracy0.37um
XY AccuracyXY direction:15um
RepeatabilityHeight:<1um (3 Sigma);volume/acreage:<1%(3 Sigma)
Gage R&R<10%
Inspection Speed1.5sec/FOV
Quantity of Inspection HeadSingle Head
Mark-point Detection Time0.5 sec/piece
Maximum Measuring Height±350um
Maximum Measuring Height
of PCB Warp
Minimum Pad Spacing150um (pad height of 150um as the reference)
Smallest Measuring SizeRectangle:150um; round:200um
Maximum PCB SizeX350 x Y250 mm
Fixed or Flexible Orbit SettingLeft orbit
SPC StatisticsHistogram;Xbar-R Chart;Xbar-S Chart;CP&CPK;%Gage Repeatability Data;SPI Daily/Weekly/Monthly Reports
Gerber & CAD Data ImportSupport Gerber format(274x,274d);manual Teach model ;
CAD X/Y,Part No.,Package Type import)
Operating System SupportWindows 7 Professional (32 bit)
Equipment Dimension
and Weight
630 x 480 x 540mm;75KG
Options1D / 2D Barcode scanner;UPS continuous power supply;rework station

Product Tags:

solder paste inspection equipment


solder paste inspection system

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