Solder Paste Inspection T-2010a
1.The use of PSLM combined with the PMP to achieve 100%
high-precision solder paste 3D measurement in SMT production line.
2.Using PSLM technology, changed the traditional way of generating
3D Struct Light, the traditional glass grating moire required
mechanically driven by a piezoelectric motor(PZT).By using PSLM, no
need glass grating and mechanical parts any more. The elimination
of the mechanical drive and moving parts, greatly improving the
ease of use and avoid mechanical wear and reduce maintenance costs.
3.By using the Stop&Catch methods combined with multiple image
acquisition, realize highly repeatable 3D results on the solder
paste measurement. Compared to conventional scanning just take one
pictures only on the solder paste a scan sampling, multiple image
acquisition greatly enhancing the accuracy and reliable test
4.Patened D-Lighting technology achieves full light spectrum detect
ability. It is perfect solution to solve the shadow effect and
reduce noise interference during 3D measurement.
5.Gerber data conversion and import, achieve automatic detection of
the entire board. Manual “teach” function realize user-friendly
programming and test job generation in case of no Gerber data
6. The maximum detectable height increased from the traditional
±350um to±1200um, not only can detect solder paste, also applies to
the detection of opaque objects, such as red glue and black epoxy
and other none transported object.
7.Friendly and simple user interface, five minutes of programming
and one key operation.
8.Powerful “statistical process control(SPC)”, Provide a plenty of
tools, user-friendly real-time monitoring, reduce defects caused by
poor solder paste printing and improve final product quality.
9.The application range like: mobile phones, tablet PC, computer
and accessories, digital cameras, camcorders, automotive, medical,
server, LED, etc.
|Measurement Principle||3D white light PSLM PMP(Programmable Spatial Light
Modulation,commonly known as moire fringe technology)|
|Measurements||Volume,acreage,height, XY offset, shape|
|Detected Defects||Missing print,insufficient tin, excessive tin, bridging,
offset,shape defects, surface contamination|
|FOV Size||26 X 20mm|
|Accuracy||XY direction:15um； height:0.37um|
|Repeatability||Height:<1um (3 Sigma)；volume/acreage:<1%(3 Sigma)|
|Quantity of Inspection Head||Single Head|
|Mark-point Detection Time||0.5 sec/piece|
|Maximum Measuring Height||±350um (±1200um * as option)|
|Maximum Measuring Height|
of PCB Warp
|Minimum Pad Spacing||150um (pad height of 150um as the reference)|
|Smallest Measuring Size||Rectangle:150um； round:200um|
|Maximum PCB Size||X460 x Y350 mm|
|Fixed or Flexible Orbit Setting||Front orbit|
|SPC Statistics||Histogram；Xbar-R Chart；Xbar-S Chart；CP&CPK；%Gage Repeatability
Data；SPI Daily/Weekly/Monthly Reports|
|Gerber & CAD Data Import||Support Gerber format(274x,274d)；manual Teach model ；|
CAD X/Y,Part No.,Package Type import)
|Operating System Support||Windows 7 Professional (32 bit)|
|810 x 930 x 530mm；95KG|
|Options||1D / 2D Barcode scanner;UPS continuous power supply;rework station|