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Morel Equipments Co.,Ltd
Morel Equipments CO.,Ltd
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T-3010 Desktop 3D Solder Paste Inspection Machine , Smt Assembly Equipment

Morel Equipments Co.,Ltd
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Morel Equipments Co.,Ltd
City: Shenzhen
Province/State: Guangdong
Country/Region: China
Tel: 86-755-21635007
Contact Person:
Mr Tom Chen

T-3010 Desktop 3D Solder Paste Inspection Machine , Smt Assembly Equipment

Brand Name : SINIC
Model Number : T-3010
Certification : CE、ISO
Place of Origin : CHINA
MOQ : 1 unit
Price : Negotiation
Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram
Delivery Time : 20 work days
Packaging Details : wooden packing
Function : High Temperature Resistance
Automatic Grade : Automatic
Machine Dimension : 1500*1100*600mm
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Desktop SPI T-3010a
1. Programmable phase modulation profilermetry (PSLM PMP): SinicTek patents, its unique programmable grating structure can use the software to set period of the grating; canceled the mechanical drive and transmission parts, greatly improving the accuracy of the equipment and scope of application, avoiding mechanical wear and maintenance costs and achieving 100% precision 3D measurement towards the printed solder paste in SMT production line.
2.SinicTek patent together with structured light technology solve problem of shadow interference in 3D solder Paste Inspection.
3.High resolution image processing system: two million pixels industry CCD camera, with highend camera, supports the fast and stable detection of 0201 solder paste. While providing 10um, 15um, 18um, 20um variety of different detection accuracy, to meet the customer's requirements as product diversity and inspection speed.
4.Quick Gerber import and programming software, can achieve 5 minutes programming, which is the fastest in the industry; artificial Teach function is convenient for programming and inspection even in the absence of Gerber data.
5.Powerful process statistical analysis (SPC): Realtime SPC information display, complete and various SPC tool that allows the users to realtime monitor problems in the production , reduce the defects caused by bad solder paste printing. It will support the operator with a strong quality control , allow the users to be be clear at a glance.

6.Equipment Repeatability << 10%
Equipment Hardware and Software Configuration:

ModelT-3010a
Measurement Principle3D white light PSLM PMP(Programmable Spatial Light Modulation,commonly
known as moire fringe technology)
MeasurementsVolume,acreage,height, XY offset, shape
Detection of Non - Performing
Types
Missing print,insufficient tin, excessive tin, bridging, offset, mal-shapes, surface contamination
Camera Pixel2M( 4M as optipon)
FOV Size26 X 20mm
AccuracyXY direction):10um; height:0.37um
RepeatabilityHeight:<1um (4 Sigma);volume/acreage:<1%(5 Sigma)
Gage R&RFar less than 10%
Inspection Speed1.5sec/FOV
Quantity of Inspection HeadSingle Head (Twin-Heads as optipon)
Mark-point Detection Time0.5 sec/piece
Maximun Meauring Height±350um (±1200um * as optipon)
Maximun Measuring Height
of PCB Warp
±2mm
Minimum Pad Spacing100um (pad height of 150um as the reference)
Smallest Measuring SizeRectangle:150um; round:200um
Maximum Loading PCB SizeX700 x Y600 mm(1000 x 600mm as optipon)
Fixed or Flexible Orbit SettingFront orbit
Engineering StatisticsHistogram;Xbar-R Chart;Xbar-S Chart;CP&CPK;%Gage Repartability
Data;SPI Daily/Weekly/Monthly Reports
Gerber & CAD Data ImportSupport Gerber format(274x,274d);manual Teach model ;
CAD X/Y,Part No.,Package Type imput)
Operating System SupportWindows 7 Professional (32 bit)
Equipment Diemension
and Weight
1500 x 1100 x 600mm;145KG
Options1D / 2D Barcode scanner;UPS continuous power supply;workstation
(T-3010a except)














Product Tags:

solder paste inspection equipment

      

spi equipment

      
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